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Andrews [41]
2 years ago
11

Non linear editing can cause _____ where edit and re-edit and re-edit again can cause video to be less true than the original ma

terial
Computers and Technology
1 answer:
Oxana [17]2 years ago
8 0

Non-linear editing can cause modification in the original video whereas editing and re-edit and re-edit again can cause the video to be less true than the original material.

<h3>What is non-linear editing?</h3>

In non-linear editing, the editor can do any operation with the video like adding or removing any frame without starting from the beginning.

It's been characterized as a ‘cut and paste’ technique that can really innovate how video makers approach videography.

Therefore Non-linear editing can cause modification in the original video whereas editing and re-editing and re-editing again can cause the video to be less true than the original material.

To know more about non-linear editing follow

brainly.com/question/15614247

#SPJ4

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3. Q3: India is a user who needs to be able to see a list of the names of her friends (those whom she considers friends). There
Katyanochek1 [597]

In order to grant India access to a list of her friends, you should use a query by selecting name from person and use the inner join relationship on person.

<h3>What is query?</h3>

A query refers to a computational request for data that are saved in a database table, from existing queries, or even from a combination of both a database table and existing queries.

In this scenario, you can grant India access to be able to see a list of her friends with a structured query language (SQL) by selecting name from person and use the inner join relationship on person.

Read more on query here: brainly.com/question/25266787

3 0
2 years ago
Que es pilar en tecnologia
Semmy [17]
Wikipedia:The thermal copper pillar bump, also known as the "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA). Unlike conventional solder bumps that provide an electrical path and a mechanical connection to the package, thermal bumps act as solid-state heat pumps and add thermal management functionality locally on the surface of a chip or to another electrical component. The diameter of a thermal bump is 238 μm and 60 μm high.

The thermal bump uses the thermoelectric effect, which is the direct conversion of temperature differences to electric voltage and vice versa. Simply put, a thermoelectric device creates a voltage when there is a different temperature on each side, or when a voltage is applied to it, it creates a temperature difference. This effect can be used to generate electricity, to measure temperature, to cool objects, or to heat them.

For each bump, thermoelectric cooling (TEC) occurs when a current is passed through the bump. The thermal bump pulls heat from one side of the device and transfers it to the other as current is passed through the material. This is known as the Peltier effect.[1] The direction of heating and cooling is determined by the direction of current flow and the sign of the majority electrical carrier in the thermoelectric material. Thermoelectric power generation (TEG) on the other hand occurs when the thermal bump is subjected to a temperature gradient (i.e., the top is hotter than the bottom). In this instance, the device generates current, converting heat into electrical power. This is termed the Seebeck effect.[1]

The thermal bump was developed by Nextreme Thermal Solutions as a method for integrating active thermal management functionality at the chip level in the same manner that transistors, resistors and capacitors are integrated in conventional circuit designs today. Nextreme chose the copper pillar bump as an integration strategy due to its widespread acceptance by Intel, Amkor and other industry leaders as the method for connecting microprocessors and other advanced electronics devices to various surfaces during a process referred to as “flip-chip” packaging. The thermal bump can be integrated as a part of the standard flip-chip process (Figure 1) or integrated as discrete devices.

The efficiency of a thermoelectric device is measured by the heat moved (or pumped) divided by the amount of electrical power supplied to move this heat. This ratio is termed the coefficient of performance or COP and is a measured characteristic of a thermoelectric device. The COP is inversely related to the temperature difference that the device produces. As you move a cooling device further away from the heat source, parasitic losses between the cooler and the heat source necessitate additional cooling power: the further the distance between source and cooler, the more cooling is required. For this reason, the cooling of electronic devices is most efficient when it occurs closest to the source of the heat generation.

Use of the thermal bump does not displace system level cooling, which is still needed to move heat out of the system; rather it introduces a fundamentally new methodology for achieving temperature uniformity at the chip and board level. In this manner, overall thermal management of the system becomes more efficient. In addition, while conventional cooling solutions scale with the size of the system (bigger fans for bigger systems, etc.), the thermal bump can scale at the chip level by using more thermal bumps in the overall design.

4 0
3 years ago
Does anyone know about the progressive era?
Umnica [9.8K]

Answer: The Progressive Era was a period of widespread social activism and political reform across the United States that spanned the 1890s to the 1920s.

Explanation:

8 0
3 years ago
Read 2 more answers
1. Write a program that declares an array named alpha with 50 components of the type double. Initialize the array so that the fi
Aleksandr [31]

Answer:

Explanation:

1. Write a program that declares an array named alpha with 50 components of the type double. Initialize the array so that the first 25 components are equal to the square of the counter (or index) variable and the last 25 components are equal to three times the index variable.  

  double alpha[50];

   for (int i=0;i<25;i++)

   {

       alpha[i]=i*i;

       alpha[i+25]=(i+25)*3;

  }

2. Output the array so that exactly ten elements per line are printed.  

   for (int i=0;i<50;i++)

   {

       cout<<i+1<<". "<<alpha[i]<<" ";

       if (((i+1)%10)==0)

       {

           cout<<endl;

       }

   }

3. Run your program again, but this time change the code so that the array is filled with random numbers between 1 and 100.  

   double alpha[50];

   for (int i=0;i<50;i++)

   {

       alpha[i]=rand()%101;

   }

   for (int i=0;i<50;i++)

   {

       cout<<i+1<<". "<<alpha[i]<<" ";

       if (((i+1)%10)==0)

       {

           cout<<endl;

       }

   }

4. Write the code that computes and prints the average of elements of the array.  

   double alpha[50],temp=0;

   for (int i=0;i<50;i++)

   {

       alpha[i]=rand()%101;

       temp+=alpha[i];

   }

   cout<<"Average :"<<(temp/50);

5. Write the code that that prints out how many of the elements are EXACTLY equal to 100.

   double alpha[50],temp=0;

   for (int i=0;i<50;i++)

   {

       alpha[i]=rand()%101;

       if(alpha[i]==100)

       {

           temp++;

       }

   }

   cout<<"Elements Exacctly 100 :"<<temp;

Please note:  If you put  each of above code to the place below comment  it will run perfectly after compiling

#include <iostream>

using namespace std;

int main()

{

   // If you put  each of above code here it will run perfectly after compiling

   return 0;

}

8 0
3 years ago
Assuming you can use infinite number of CPUS for performance improvements, what would be the maximum speed up when the paralleli
natita [175]

Answer:

correct option is D i.e. 20

Explanation:

Given data:

Parallelizable portion is  given as 95%

so remaining will be serial portion i.e. 5%

we know that, for infinite number of cpus, maximum speed is calculated as

v =\frac{1}{f}

where f denote serial portion = 5% = 0.05

v = \frac{1}{0.05}

v = 20

hence so for serial portion of 5%, maximum speed is 20

correct option is D i.e. 20

3 0
3 years ago
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