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shepuryov [24]
3 years ago
15

While doing research on the Internet, what kind of website should you avoid because the information may be biased? A) .org. B) .

gov. C) .edu. D) .com
Computers and Technology
2 answers:
zhenek [66]3 years ago
5 0
.org which stands for organizations. The second most biased would be .com
.gov and .edu are mostly researched websites that have real sources.
Lesechka [4]3 years ago
3 0
Yep. I agree what the first person said. The most reliable and trustworthy sites out of all these are .gov and .edu. From these two if you're talking about school work research then you should go with .edu.
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Survey data are collected by using all of these methods EXCEPT
castortr0y [4]

Answer:

Survey data are collected by using all of these methods except Field Research.

Explanation:

In field research data has been gathered from different experiments, qualitative analysis and observations of any event.

On the other hand, survey data can be collected from Following:

<u>structured interview</u><u>:</u>

where data can be gathered by interviews and analyzed it on quantitative basis.

<u>Face to face questionnaires:</u>

Data has been collected by asking questions directly from users in the form of interview.

<u>self-administered questionnaires</u>

In this research, questionnaire has been designed to asked question related to some topic without conducting interview.

8 0
3 years ago
A type of specialty processor devoted exclusively to protecting your privacy.
drek231 [11]
 Cryptoprocessor would be it.
8 0
3 years ago
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Que es pilar en tecnologia
Semmy [17]
Wikipedia:The thermal copper pillar bump, also known as the "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA). Unlike conventional solder bumps that provide an electrical path and a mechanical connection to the package, thermal bumps act as solid-state heat pumps and add thermal management functionality locally on the surface of a chip or to another electrical component. The diameter of a thermal bump is 238 μm and 60 μm high.

The thermal bump uses the thermoelectric effect, which is the direct conversion of temperature differences to electric voltage and vice versa. Simply put, a thermoelectric device creates a voltage when there is a different temperature on each side, or when a voltage is applied to it, it creates a temperature difference. This effect can be used to generate electricity, to measure temperature, to cool objects, or to heat them.

For each bump, thermoelectric cooling (TEC) occurs when a current is passed through the bump. The thermal bump pulls heat from one side of the device and transfers it to the other as current is passed through the material. This is known as the Peltier effect.[1] The direction of heating and cooling is determined by the direction of current flow and the sign of the majority electrical carrier in the thermoelectric material. Thermoelectric power generation (TEG) on the other hand occurs when the thermal bump is subjected to a temperature gradient (i.e., the top is hotter than the bottom). In this instance, the device generates current, converting heat into electrical power. This is termed the Seebeck effect.[1]

The thermal bump was developed by Nextreme Thermal Solutions as a method for integrating active thermal management functionality at the chip level in the same manner that transistors, resistors and capacitors are integrated in conventional circuit designs today. Nextreme chose the copper pillar bump as an integration strategy due to its widespread acceptance by Intel, Amkor and other industry leaders as the method for connecting microprocessors and other advanced electronics devices to various surfaces during a process referred to as “flip-chip” packaging. The thermal bump can be integrated as a part of the standard flip-chip process (Figure 1) or integrated as discrete devices.

The efficiency of a thermoelectric device is measured by the heat moved (or pumped) divided by the amount of electrical power supplied to move this heat. This ratio is termed the coefficient of performance or COP and is a measured characteristic of a thermoelectric device. The COP is inversely related to the temperature difference that the device produces. As you move a cooling device further away from the heat source, parasitic losses between the cooler and the heat source necessitate additional cooling power: the further the distance between source and cooler, the more cooling is required. For this reason, the cooling of electronic devices is most efficient when it occurs closest to the source of the heat generation.

Use of the thermal bump does not displace system level cooling, which is still needed to move heat out of the system; rather it introduces a fundamentally new methodology for achieving temperature uniformity at the chip and board level. In this manner, overall thermal management of the system becomes more efficient. In addition, while conventional cooling solutions scale with the size of the system (bigger fans for bigger systems, etc.), the thermal bump can scale at the chip level by using more thermal bumps in the overall design.

4 0
3 years ago
Describe the concepts of confidentiality, integrity, and availability (C-I-A), and explain each of the seven domains of a typica
GREYUIT [131]

Answer:

Answer explained below. The remaining part of the question is incomplete

Explanation:

The concepts of confidentiality, integrity, and availability (C-I-A) can be explained in following given points.

1) Confidentiality: Its basically refer to the confidentiality of the information. Here we can think about the protection of the information from unauthorized person. Confidentiality enuser that at what level your information is secured and no unauthorized access will be done to the information. For maintaining the confidentiality, we can use various encryption methods. The main concept of confidentiality is to enforce various techniques like encryption, file permissions and access control to restrict access to important information.

2) Integrity: Integrity of the information refer to the unwanted modification of the information. Integrity of the data as well as the information should be maintained and only the autorized person can access as well as modify the information. For enforcing the integrity, we can implement various hashing techniques on information.

3) Availability: Availability refers to the availability of the information, when ever an autorized person requests for the information. High availability of the information should occur, so that any autorized person can access it, when ever its required. For high availability, we can create backup as well as replicate the data across the geo sites.

Seven domains of a typical IT infrastructure are given below:

1) User Domain: Its refer to the group of users as well as the person who access the information systems.

2) LAN Domain: Refer to the local area network, where various computers are connected to each other.

3) Workstation Domain: The area is called workstation, where various users connect to the IT infrastructure.

4) WAN and LAN link domain: Refer to the connection of local area network to wide area network.

5) WAN domain: Refer to the wide area network, connection of computers in large area.

6) Storage Domain: Refer to the storage, where we store the data.

7) Remote Access Domain: Refer to the domain where mobile user can access the local as well as wide network remotely.

8 0
3 years ago
The three Fs of product design are form, fit and
Rudiy27

Answer: Function

Explanation: <em>"Function is a criterion that is met when the part performs its stated purpose effectively and reliably. In an electronics product, for example, function can depend on the solid-state components used, the software or firmware, and quite often on the features of the electronics enclosure selected. Poorly placed or sized ports and misleading or missing labeling are two of the most common ways in which an enclosure can fail the function criterion."</em>

5 0
3 years ago
Read 2 more answers
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