What is the definition of a nested function?

In a non-price rationing system, consumers receive goods and services first-come, first served. Give me an example of a time whe

Anna35 [415]

When someone may be giving away something for free.

7 0

3 years ago

Write a program that grades arithmetic quizzes as follows: Ask the user how many questions are in the quiz. Ask the user to ente

kirill115 [55]

Answer:

The program in C++ is as follows:

#include <iostream>

using namespace std;

int main(){

int questions, answer;

cout<<"Questions: ";

cin>>questions;

int answerkey[questions];

cout<<"Enter answer keys: ";

for(int i = 0; i< questions; i++){

cin>>answerkey[i]; }

int correct = 0;

cout<<"Enter answers: ";

for(int i = 0; i< questions; i++){

cin>>answer;

if(answer == answerkey[i]){

correct++; } }

cout<<"Correct answers: "<<correct<<endl;

cout<<"Percentage correct : "<<(100 * correct)/questions<<"%";

return 0;

}

Explanation:

This declares the number of questions and the answers submitted to each equation

int questions, answer;

Prompt to get the number of questions

cout<<"Questions: ";

This gets input for the number of questions

cin>>questions;

This declares the answerkey as an array

int answerkey[questions];

Prompt to get the answer key

cout<<"Enter answer keys: ";

This iteration gets the answer key for each question

<em> cin>>answerkey[i]; }</em>

This initializes the number of correct answers to 0

int correct = 0;

Prompt to get the enter the answers

cout<<"Enter answers: ";

This iterates through the answer keys

for(int i = 0; i< questions; i++){

This gets the answer to each question

cin>>answer;

This compares the answer to the answer key of the question

if(answer == answerkey[i]){

If they are the same, correct is incremented by 1

correct++; } }

Print the number of correct answers

cout<<"Correct answers: "<<correct<<endl;

Print the percentage of correct answers

cout<<"Percentage correct : "<<(100 * correct)/questions<<"%";

7 0

3 years ago

Que es pilar en tecnologia

Semmy [17]

Wikipedia:The thermal copper pillar bump, also known as the "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA). Unlike conventional solder bumps that provide an electrical path and a mechanical connection to the package, thermal bumps act as solid-state heat pumps and add thermal management functionality locally on the surface of a chip or to another electrical component. The diameter of a thermal bump is 238 μm and 60 μm high.

The thermal bump uses the thermoelectric effect, which is the direct conversion of temperature differences to electric voltage and vice versa. Simply put, a thermoelectric device creates a voltage when there is a different temperature on each side, or when a voltage is applied to it, it creates a temperature difference. This effect can be used to generate electricity, to measure temperature, to cool objects, or to heat them.

For each bump, thermoelectric cooling (TEC) occurs when a current is passed through the bump. The thermal bump pulls heat from one side of the device and transfers it to the other as current is passed through the material. This is known as the Peltier effect.[1] The direction of heating and cooling is determined by the direction of current flow and the sign of the majority electrical carrier in the thermoelectric material. Thermoelectric power generation (TEG) on the other hand occurs when the thermal bump is subjected to a temperature gradient (i.e., the top is hotter than the bottom). In this instance, the device generates current, converting heat into electrical power. This is termed the Seebeck effect.[1]

The thermal bump was developed by Nextreme Thermal Solutions as a method for integrating active thermal management functionality at the chip level in the same manner that transistors, resistors and capacitors are integrated in conventional circuit designs today. Nextreme chose the copper pillar bump as an integration strategy due to its widespread acceptance by Intel, Amkor and other industry leaders as the method for connecting microprocessors and other advanced electronics devices to various surfaces during a process referred to as “flip-chip” packaging. The thermal bump can be integrated as a part of the standard flip-chip process (Figure 1) or integrated as discrete devices.

The efficiency of a thermoelectric device is measured by the heat moved (or pumped) divided by the amount of electrical power supplied to move this heat. This ratio is termed the coefficient of performance or COP and is a measured characteristic of a thermoelectric device. The COP is inversely related to the temperature difference that the device produces. As you move a cooling device further away from the heat source, parasitic losses between the cooler and the heat source necessitate additional cooling power: the further the distance between source and cooler, the more cooling is required. For this reason, the cooling of electronic devices is most efficient when it occurs closest to the source of the heat generation.

Use of the thermal bump does not displace system level cooling, which is still needed to move heat out of the system; rather it introduces a fundamentally new methodology for achieving temperature uniformity at the chip and board level. In this manner, overall thermal management of the system becomes more efficient. In addition, while conventional cooling solutions scale with the size of the system (bigger fans for bigger systems, etc.), the thermal bump can scale at the chip level by using more thermal bumps in the overall design.

4 0

3 years ago

Write a program that prompts the user to input a number. The program should then output the number and a message saying whether

Gala2k [10]

Answer:

Following is the program in C++ Language

#include <iostream> // header file

using namespace std; // namespace std

int main() // main method

{

int n; // variable declaration

cout<<" Please enter the number :";

cin>>n; // Read the number

if(n>0) // check the condition when number is positive

{

cout<<n<<endl<<"The number is Positive"; // Display number

}

else if(n<0) // check the condition when number is Negative

{

cout<<n<<endl<<"The number is Negative";// Display number

}

else // check the condition when number is Zero

{

cout<<n<<endl<<"The number is Zero";// Display number

}

return 0;

}

Output:

Please enter the number:

64

The number is Positive

Explanation:

Following are the description of the program

Declared a variable "n" of int type.
Read the value of "n" by user.
Check the condition of positive number by using if block statement .If n>0 it print the number is positive.
Check the condition of negative number by using else if block statement If n<0 it print the number is negative.
Finally if both the above condition is fail it print the message " The number is Zero"

7 0

3 years ago

A general rule for adding text to a slide is ____.

KiRa [710]

A general rule for adding text to a slide is to use not more than two fonts in a presentation and vary the font size. Besides adding text you can also import text, photographs, numerical data, and facts from files created in programs such as Microsoft word, excel and access.

5 0

3 years ago

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