1answer.
Ask question
Login Signup
Ask question
All categories
  • English
  • Mathematics
  • Social Studies
  • Business
  • History
  • Health
  • Geography
  • Biology
  • Physics
  • Chemistry
  • Computers and Technology
  • Arts
  • World Languages
  • Spanish
  • French
  • German
  • Advanced Placement (AP)
  • SAT
  • Medicine
  • Law
  • Engineering
ss7ja [257]
2 years ago
10

Help please match them if you just put a link or say “I don’t know but thanks for the points” I’ll report your answer and you wo

n’t get the brainliest

Computers and Technology
1 answer:
Amanda [17]2 years ago
8 0

Answer:

Input: The user clicks a button

Output: A song is played

User interface: A screen with buttons, images, and text

Explanation:

You might be interested in
The chip that controls the radio frequency waves within a device
torisob [31]

Answer:

An RF module

Explanation:

I googled it lol

7 0
3 years ago
PA theme is a major message that a writer convoys through a text. you have explored many themes in the hobbit one theme in the n
Nataly [62]

Answer:

The Hobbit’s main theme is Bilbo’s development into a hero, which more broadly represents the development of a common person into a hero. At the beginning of the story, Bilbo is timid, comfortable, and complacent in his secure little hole at Bag End. When Gandalf talks him into embarking on the quest with Thorin’s dwarves, Bilbo becomes so frightened that he faints. But as the novel progresses, Bilbo prevails in the face of danger and adversity, justifying Gandalf’s early claim that there is more to the little hobbit than meets the eye.??????

Explanation:

7 0
2 years ago
Que es pilar en tecnologia
Semmy [17]
Wikipedia:The thermal copper pillar bump, also known as the "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA). Unlike conventional solder bumps that provide an electrical path and a mechanical connection to the package, thermal bumps act as solid-state heat pumps and add thermal management functionality locally on the surface of a chip or to another electrical component. The diameter of a thermal bump is 238 μm and 60 μm high.

The thermal bump uses the thermoelectric effect, which is the direct conversion of temperature differences to electric voltage and vice versa. Simply put, a thermoelectric device creates a voltage when there is a different temperature on each side, or when a voltage is applied to it, it creates a temperature difference. This effect can be used to generate electricity, to measure temperature, to cool objects, or to heat them.

For each bump, thermoelectric cooling (TEC) occurs when a current is passed through the bump. The thermal bump pulls heat from one side of the device and transfers it to the other as current is passed through the material. This is known as the Peltier effect.[1] The direction of heating and cooling is determined by the direction of current flow and the sign of the majority electrical carrier in the thermoelectric material. Thermoelectric power generation (TEG) on the other hand occurs when the thermal bump is subjected to a temperature gradient (i.e., the top is hotter than the bottom). In this instance, the device generates current, converting heat into electrical power. This is termed the Seebeck effect.[1]

The thermal bump was developed by Nextreme Thermal Solutions as a method for integrating active thermal management functionality at the chip level in the same manner that transistors, resistors and capacitors are integrated in conventional circuit designs today. Nextreme chose the copper pillar bump as an integration strategy due to its widespread acceptance by Intel, Amkor and other industry leaders as the method for connecting microprocessors and other advanced electronics devices to various surfaces during a process referred to as “flip-chip” packaging. The thermal bump can be integrated as a part of the standard flip-chip process (Figure 1) or integrated as discrete devices.

The efficiency of a thermoelectric device is measured by the heat moved (or pumped) divided by the amount of electrical power supplied to move this heat. This ratio is termed the coefficient of performance or COP and is a measured characteristic of a thermoelectric device. The COP is inversely related to the temperature difference that the device produces. As you move a cooling device further away from the heat source, parasitic losses between the cooler and the heat source necessitate additional cooling power: the further the distance between source and cooler, the more cooling is required. For this reason, the cooling of electronic devices is most efficient when it occurs closest to the source of the heat generation.

Use of the thermal bump does not displace system level cooling, which is still needed to move heat out of the system; rather it introduces a fundamentally new methodology for achieving temperature uniformity at the chip and board level. In this manner, overall thermal management of the system becomes more efficient. In addition, while conventional cooling solutions scale with the size of the system (bigger fans for bigger systems, etc.), the thermal bump can scale at the chip level by using more thermal bumps in the overall design.

4 0
3 years ago
A coffee shop is considering accepting orders and payments through their phone app and have decided to use public key encryption
Charra [1.4K]

Answer: Yes

Explanation:

Public key encryption is the encryption technique that is used for private keys and public keys for securing the system.Public key is used for encryption and private key is for decryption.Public keys can only open content of the system

  • According to the question, public key encryption is secure for coffee shop customer payment process as they are stored on digital certificates in long form for verifying digital signature and encrypting information.Its computation is difficult to crack through power computer access.  
  • Other options is incorrect as encryption is not a problem for payment procedures. Thus, the correct option is yes ,public key encryption is secure method for coffee shop customers .
8 0
3 years ago
Which type of books contains snapshots of steps that help to perform an activity?
stellarik [79]

Answer:

online book,,.........,.

5 0
3 years ago
Read 2 more answers
Other questions:
  • 2- There are many different design parameters that are important to a cache’s overall performance. Below are listed parameters f
    11·1 answer
  • James Hutton:
    8·1 answer
  • What is the basic purpose of Google calendar?
    14·2 answers
  • Readability is the level of vocabulary used on the page. True or false
    8·1 answer
  • Although some families have more resources than other families, there is always a limited amount of resources that families have
    15·2 answers
  • is there anybody out there who is a social butterfly like me? If so then you can tlk to me on this. and to anybody out there tha
    12·1 answer
  • Rachel typed two paragraphs and then realized she was in the wrong document. What steps should Rachel follow to quickly move the
    15·2 answers
  • Characteristics of RAM​
    5·1 answer
  • Choose the best answer from the drop-down menu. A ______ allows multiple connections to a single signal. Without a ______, conne
    7·2 answers
  • How many 3 byte sequences contain at least five consecutive 0-bits
    7·1 answer
Add answer
Login
Not registered? Fast signup
Signup
Login Signup
Ask question!