All categories

3 years ago

Charts are inserted into an excel spreadsheet using the commands in the charts group on the ____ tab on the ribbon.

1 answer:

7 0

Charts are inserted into an excel spreadsheet using the commands in the charts group on the Insert tab on the ribbon.
There, on the Insert tab, you will find many options when it comes to the things that you want to insert into your Excel spreadsheet, such as images, tables, and charts, among other things.

You might be interested in

) Perform error checking for the data point entries. If any of the following errors occurs, output the appropriate error message

emmainna [20.7K]

Answer:

In Python:

entry = input("Sentence: ")

while True:

if entry.count(",") == 0:

print("Error: No comma in string")

entry = input("Sentence: ")

elif entry.count(",") > 1:

print("Error: Too many comma in input")

entry = input("Sentence: ")

else:

ind = entry.index(',')+1

if entry[ind].isnumeric() == False:

print("Comma not followed by an integer")

entry = input("Sentence: ")

else:

break

print("Valid Input")

Explanation:

This prompts the user for a sentence

entry = input("Sentence: ")

The following loop is repeated until the user enters a valid entry

while True:

This is executed if the number of commas is 0

if entry.count(",") == 0:

print("Error: No comma in string")

entry = input("Sentence: ")

This is executed if the number of commas is more than 1

elif entry.count(",") > 1:

print("Error: Too many comma in input")

entry = input("Sentence: ")

This is executed if the number of commas is 1

else:

This calculates the next index after the comma

ind = entry.index(',')+1

This checks if the character after the comma is a number

if entry[ind].isnumeric() == False:

If it is not a number, the print statement is executed

print("Comma not followed by an integer")

entry = input("Sentence: ")

If otherwise, the loop is exited

else:

break

This prints valid input, when the user enters a valid string

print("Valid Input")

Note that: entry = input("Sentence: ") is used to get input

4 0

3 years ago

Find the area of the regular hexagon below by using the area formula for triangles.

mojhsa [17]

I think the answer is B. Because if you multiply 6x8 it’s 48 divided by 2 equals 24

5 0

3 years ago

Just answer in five-line. Question:

Eddi Din [679]

Answer:

It is a half-duplex serial transmission mode, and this can be provided through the RS-485 two wired electrical interface. And this can be connected to the ethernet if required, connect to the LAN, and finally transmitting the video footage to all the screens. And the two reasons are:

1. Noiseless

2. Allows around 32 receivers.

Explanation:

Please check the answer.

3 0

3 years ago

Imagine that you work for a company directly related to your major. Your company is preparing for expansion and your boss, Ms. S

shutvik [7]

Answer:

start with what you know

Explanation:

6 0

2 years ago

Que es pilar en tecnologia

Semmy [17]

Wikipedia:The thermal copper pillar bump, also known as the "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA). Unlike conventional solder bumps that provide an electrical path and a mechanical connection to the package, thermal bumps act as solid-state heat pumps and add thermal management functionality locally on the surface of a chip or to another electrical component. The diameter of a thermal bump is 238 μm and 60 μm high.

The thermal bump uses the thermoelectric effect, which is the direct conversion of temperature differences to electric voltage and vice versa. Simply put, a thermoelectric device creates a voltage when there is a different temperature on each side, or when a voltage is applied to it, it creates a temperature difference. This effect can be used to generate electricity, to measure temperature, to cool objects, or to heat them.

For each bump, thermoelectric cooling (TEC) occurs when a current is passed through the bump. The thermal bump pulls heat from one side of the device and transfers it to the other as current is passed through the material. This is known as the Peltier effect.[1] The direction of heating and cooling is determined by the direction of current flow and the sign of the majority electrical carrier in the thermoelectric material. Thermoelectric power generation (TEG) on the other hand occurs when the thermal bump is subjected to a temperature gradient (i.e., the top is hotter than the bottom). In this instance, the device generates current, converting heat into electrical power. This is termed the Seebeck effect.[1]

The thermal bump was developed by Nextreme Thermal Solutions as a method for integrating active thermal management functionality at the chip level in the same manner that transistors, resistors and capacitors are integrated in conventional circuit designs today. Nextreme chose the copper pillar bump as an integration strategy due to its widespread acceptance by Intel, Amkor and other industry leaders as the method for connecting microprocessors and other advanced electronics devices to various surfaces during a process referred to as “flip-chip” packaging. The thermal bump can be integrated as a part of the standard flip-chip process (Figure 1) or integrated as discrete devices.

The efficiency of a thermoelectric device is measured by the heat moved (or pumped) divided by the amount of electrical power supplied to move this heat. This ratio is termed the coefficient of performance or COP and is a measured characteristic of a thermoelectric device. The COP is inversely related to the temperature difference that the device produces. As you move a cooling device further away from the heat source, parasitic losses between the cooler and the heat source necessitate additional cooling power: the further the distance between source and cooler, the more cooling is required. For this reason, the cooling of electronic devices is most efficient when it occurs closest to the source of the heat generation.

Use of the thermal bump does not displace system level cooling, which is still needed to move heat out of the system; rather it introduces a fundamentally new methodology for achieving temperature uniformity at the chip and board level. In this manner, overall thermal management of the system becomes more efficient. In addition, while conventional cooling solutions scale with the size of the system (bigger fans for bigger systems, etc.), the thermal bump can scale at the chip level by using more thermal bumps in the overall design.

4 0

2 years ago