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mario62 [17]
3 years ago
11

Que es pilar en tecnologia

Computers and Technology
1 answer:
Semmy [17]3 years ago
4 0
Wikipedia:The thermal copper pillar bump, also known as the "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA). Unlike conventional solder bumps that provide an electrical path and a mechanical connection to the package, thermal bumps act as solid-state heat pumps and add thermal management functionality locally on the surface of a chip or to another electrical component. The diameter of a thermal bump is 238 μm and 60 μm high.

The thermal bump uses the thermoelectric effect, which is the direct conversion of temperature differences to electric voltage and vice versa. Simply put, a thermoelectric device creates a voltage when there is a different temperature on each side, or when a voltage is applied to it, it creates a temperature difference. This effect can be used to generate electricity, to measure temperature, to cool objects, or to heat them.

For each bump, thermoelectric cooling (TEC) occurs when a current is passed through the bump. The thermal bump pulls heat from one side of the device and transfers it to the other as current is passed through the material. This is known as the Peltier effect.[1] The direction of heating and cooling is determined by the direction of current flow and the sign of the majority electrical carrier in the thermoelectric material. Thermoelectric power generation (TEG) on the other hand occurs when the thermal bump is subjected to a temperature gradient (i.e., the top is hotter than the bottom). In this instance, the device generates current, converting heat into electrical power. This is termed the Seebeck effect.[1]

The thermal bump was developed by Nextreme Thermal Solutions as a method for integrating active thermal management functionality at the chip level in the same manner that transistors, resistors and capacitors are integrated in conventional circuit designs today. Nextreme chose the copper pillar bump as an integration strategy due to its widespread acceptance by Intel, Amkor and other industry leaders as the method for connecting microprocessors and other advanced electronics devices to various surfaces during a process referred to as “flip-chip” packaging. The thermal bump can be integrated as a part of the standard flip-chip process (Figure 1) or integrated as discrete devices.

The efficiency of a thermoelectric device is measured by the heat moved (or pumped) divided by the amount of electrical power supplied to move this heat. This ratio is termed the coefficient of performance or COP and is a measured characteristic of a thermoelectric device. The COP is inversely related to the temperature difference that the device produces. As you move a cooling device further away from the heat source, parasitic losses between the cooler and the heat source necessitate additional cooling power: the further the distance between source and cooler, the more cooling is required. For this reason, the cooling of electronic devices is most efficient when it occurs closest to the source of the heat generation.

Use of the thermal bump does not displace system level cooling, which is still needed to move heat out of the system; rather it introduces a fundamentally new methodology for achieving temperature uniformity at the chip and board level. In this manner, overall thermal management of the system becomes more efficient. In addition, while conventional cooling solutions scale with the size of the system (bigger fans for bigger systems, etc.), the thermal bump can scale at the chip level by using more thermal bumps in the overall design.

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Explanation:

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Develop a C program that calculates the final score and the average score for a student from his/her (1)class participation, (2)
Ghella [55]

Answer:

#include <iomanip>

#include<iostream>

using namespace std;

int main(){

char name[100];

float classp, test, assgn, exam, prctscore,ave;

cout<<"Student Name: ";

cin.getline(name,100);

cout<<"Class Participation: "; cin>>classp;

while(classp <0 || classp > 100){  cout<<"Class Participation: "; cin>>classp; }

cout<<"Test: "; cin>>test;

while(test <0 || test > 100){  cout<<"Test: "; cin>>test; }

cout<<"Assignment: "; cin>>assgn;

while(assgn <0 || assgn > 100){  cout<<"Assignment: "; cin>>assgn; }

cout<<"Examination: "; cin>>exam;

while(exam <0 || exam > 100){  cout<<"Examination: "; cin>>exam; }

cout<<"Practice Score: "; cin>>prctscore;

while(prctscore <0 || prctscore > 100){  cout<<"Practice Score: "; cin>>prctscore; }

ave = (int)(classp + test + assgn + exam + prctscore)/5;

cout <<setprecision(1)<<fixed<<"The average score is "<<ave;  

return 0;}

Explanation:

The required parameters such as cin, cout, etc. implies that the program is to be written in C++ (not C).

So, I answered the program using C++.

Line by line explanation is as follows;

This declares name as character of maximum size of 100 characters

char name[100];

This declares the grading items as float

float classp, test, assgn, exam, prctscore,ave;

This prompts the user for student name

cout<<"Student Name: ";

This gets the student name using getline

cin.getline(name,100);

This prompts the user for class participation. The corresponding while loop ensures that the score s between 0 and 100 (inclusive)

<em> cout<<"Class Participation: "; cin>>classp; </em>

<em> while(classp <0 || classp > 100){  cout<<"Class Participation: "; cin>>classp; } </em>

This prompts the user for test. The corresponding while loop ensures that the score s between 0 and 100 (inclusive)

<em> cout<<"Test: "; cin>>test; </em>

<em> while(test <0 || test > 100){  cout<<"Test: "; cin>>test; } </em>

This prompts the user for assignment. The corresponding while loop ensures that the score s between 0 and 100 (inclusive)

<em> cout<<"Assignment: "; cin>>assgn; </em>

<em> while(assgn <0 || assgn > 100){  cout<<"Assignment: "; cin>>assgn; } </em>

This prompts the user for examination. The corresponding while loop ensures that the score s between 0 and 100 (inclusive)

<em> cout<<"Examination: "; cin>>exam; </em>

<em> while(exam <0 || exam > 100){  cout<<"Examination: "; cin>>exam; } </em>

This prompts the user for practice score. The corresponding while loop ensures that the score s between 0 and 100 (inclusive)

<em> cout<<"Practice Score: "; cin>>prctscore; </em>

<em> while(prctscore <0 || prctscore > 100){  cout<<"Practice Score: "; cin>>prctscore; } </em>

This calculates the average of the grading items

ave = (int)(classp + test + assgn + exam + prctscore)/5;

This prints the calculated average

cout <<setprecision(1)<<fixed<<"The average score is "<<ave;  

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In the C programming language, you can't determine the array size from the parameter, so you have to pass it in as an extra parameter. The solution could be:

#include <stdio.h>

void swaparrayends(int arr[], int nrElements)
{
int temp = arr[0];
arr[0] = arr[nrElements - 1];
arr[nrElements - 1] = temp;
}


void main()
{
int i;
int myArray[] = { 1,2,3,4,5 };
int nrElements = sizeof(myArray) / sizeof(myArray[0]);
swaparrayends(myArray, nrElements);

for (i = 0; i < nrElements; i++)
{
printf("%d ", myArray[i]);
}

getchar();
}

In higher languages like C# it becomes much simpler:

        static void Main(string[] args)
        {
            int[] myArray = {1, 2, 3, 4, 5};
            swaparrayends(myArray);
            foreach (var el in myArray)
            {
                Console.Write(el + " ");
            }

            Console.ReadLine();
        }

        static void swaparrayends(int[] arr)
        {
            int temp = arr[0];
            arr[0] = arr.Last();
            arr[arr.Length - 1] = temp;
        }

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Explanation:

A hypertext Markup language is used for designing the web page when we added the CSS on the web page we can create the web page more efficient manner and also there is more control over the web page because we can easily call the classes of CSS.

The Hypertext Markup language version 4.01 provides greater flexibility on the web page also We can also control the page layout in a very easy manner. The appearance of the web page is good as compared to version HTML 4

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Answer:

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Explanation:

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That is mildly unpleasant when you are doing an in house presentation in front of your colleagues.But can become utterly embrassing when you are presenting in front of larger audience presentation to prospective customers.

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