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kiruha [24]
2 years ago
5

Which of the following is an advantage of text HTML editors over plain text editors?

Computers and Technology
2 answers:
zubka84 [21]2 years ago
5 0
C hope that helps have a good day and I feel you good for big hugs
Stella [2.4K]2 years ago
3 0
The answer is C, hope this helped.
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Word Online works exact same as the downloaded Office 2016 version.<br>True<br>False​
melisa1 [442]

Answer:

The Answer is false. They work similarly but quite differently on a lot of offerings from them. Office 365 and office.com are online version, and Office 2016 is a desktop version.

Explanation:

I am not going very deep into this but the facts I am mentioning will clarify your doubts.

Office 2016 offers so many ways to share a file even though we work offline on it We can email the document, share on social media as well as store on One drive. However, Office 365, and especially Word online does not allow any other sharing options than sending an invitation or sharing a link.

For Word Online you will need internet all the time, though you can work from anywhere, and even on any device. Word 2016 does not require internet, but provide a lot of analytics features and even data mining facilities when it is connected to the internet.

Watch out for Word online 2019 version, and office 2019 desktop version. They are awesome and provides AI features, and a lot more than 2016 versions, both desktop and online.

3 0
3 years ago
What are the data types in access​
Julli [10]

Answer:

Data type in Microsoft Access Database

Text  

Memo  

Byte  

Integer

Long  

Single  

Double  

Currency  

AutoNumber  

Date/Time  

Yes/No  

Ole Object  

Hyperlink  

Lookup Wizard

Explanation:

4 0
3 years ago
Which term describes the second core IPSec security protocol; it can perform authentication to provide integrity protection, alt
Sphinxa [80]

Answer:

Encapsulating Security Payload (ESP)

Explanation:

Encapsulating Security Payload is also known as ESP, it is a protocol that exists within IPSec, it helps in determining the authentication, integrity and how confidential network pack data / Payload in IPV4 and IPV6 networks are.

ESP supplies messages /Payload encipher, it also helps in authenticating Payload as well as where it originated from in the IPSec protocol suite.

6 0
3 years ago
Que es pilar en tecnologia
Semmy [17]
Wikipedia:The thermal copper pillar bump, also known as the "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA). Unlike conventional solder bumps that provide an electrical path and a mechanical connection to the package, thermal bumps act as solid-state heat pumps and add thermal management functionality locally on the surface of a chip or to another electrical component. The diameter of a thermal bump is 238 μm and 60 μm high.

The thermal bump uses the thermoelectric effect, which is the direct conversion of temperature differences to electric voltage and vice versa. Simply put, a thermoelectric device creates a voltage when there is a different temperature on each side, or when a voltage is applied to it, it creates a temperature difference. This effect can be used to generate electricity, to measure temperature, to cool objects, or to heat them.

For each bump, thermoelectric cooling (TEC) occurs when a current is passed through the bump. The thermal bump pulls heat from one side of the device and transfers it to the other as current is passed through the material. This is known as the Peltier effect.[1] The direction of heating and cooling is determined by the direction of current flow and the sign of the majority electrical carrier in the thermoelectric material. Thermoelectric power generation (TEG) on the other hand occurs when the thermal bump is subjected to a temperature gradient (i.e., the top is hotter than the bottom). In this instance, the device generates current, converting heat into electrical power. This is termed the Seebeck effect.[1]

The thermal bump was developed by Nextreme Thermal Solutions as a method for integrating active thermal management functionality at the chip level in the same manner that transistors, resistors and capacitors are integrated in conventional circuit designs today. Nextreme chose the copper pillar bump as an integration strategy due to its widespread acceptance by Intel, Amkor and other industry leaders as the method for connecting microprocessors and other advanced electronics devices to various surfaces during a process referred to as “flip-chip” packaging. The thermal bump can be integrated as a part of the standard flip-chip process (Figure 1) or integrated as discrete devices.

The efficiency of a thermoelectric device is measured by the heat moved (or pumped) divided by the amount of electrical power supplied to move this heat. This ratio is termed the coefficient of performance or COP and is a measured characteristic of a thermoelectric device. The COP is inversely related to the temperature difference that the device produces. As you move a cooling device further away from the heat source, parasitic losses between the cooler and the heat source necessitate additional cooling power: the further the distance between source and cooler, the more cooling is required. For this reason, the cooling of electronic devices is most efficient when it occurs closest to the source of the heat generation.

Use of the thermal bump does not displace system level cooling, which is still needed to move heat out of the system; rather it introduces a fundamentally new methodology for achieving temperature uniformity at the chip and board level. In this manner, overall thermal management of the system becomes more efficient. In addition, while conventional cooling solutions scale with the size of the system (bigger fans for bigger systems, etc.), the thermal bump can scale at the chip level by using more thermal bumps in the overall design.

4 0
3 years ago
In a java class, variables can be present both inside and outside of methods. question 9 options:
Tems11 [23]
The correct answer is: True

Explanation:

Consider the following program:
<span>class Main {
int a = 10;
public static void main(String[] args) {
add();
}

private static void add() {
int b = a+20;
System.out.println(b);
}<span>
}


The output of the above program is 30. As you can see the variable a is declared outside the method, whereas variable b is declared inside the method.</span></span>
3 0
3 years ago
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