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vampirchik [111]
2 years ago
13

What is a distinguishing feature of 5G mmWave

Computers and Technology
1 answer:
Tatiana [17]2 years ago
5 0

Answer:

Explanation:

mmWave sử dụng phổ vô tuyến tần số cao (từ 24 GHz đến khoảng 39 GHz) để hoạt động, cho phép tăng tốc độ (và thậm chí xa hơn, trong một số trường hợp) 1Gbps. Vấn đề là việc tăng tần số lên càng cao thì khả năng đâm xuyên càng kém đi và khoảng cách truyền ngắn lại, theo Qualcomm thì đôi khi chỉ cần một bàn tay chắn trước điện thoại là đủ để máy khôngBên cạnh đó, mmWave cũng có khả năng làm hao pin thiết bị hơn, ít nhất là ở thời điểm hiện tại. Theo đó, việc tải xuống nhiều dữ liệu hơn có nghĩa là CPU điện thoại của bạn sẽ hoạt động mạnh hơn, nhanh nhất có thể để xử lý tất cả và điều đó sẽ ảnh hưởng đến tuổi thọ pin nhận tín hiệu.

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Are the blank space around the edges of the page
Law Incorporation [45]

Answer:

The blank space around the edges of a sheet of paper — as with the page of a book — that surrounds the text is called the margin.

8 0
2 years ago
What is the multiplier effect, and how can you prevent if from happening?
nadezda [96]

Answer:

 The multiplier effect is the economical process that basically increase the final and national income disproportionately which results in the greater consumption as compared to the amount of the initial spend.

 In other words we can define as the capital implantation, regardless of whether it is in the legislative or corporate level, ought to have snowball impact in the monetary action.

It can be prevent by many ways by increasing the reserve ratio in the economical sector and by also increasing the taxes.

7 0
3 years ago
g Which statement is true about the difference between combinational logic circuits and sequential logic circuits? A) Combinatio
kogti [31]

Answer:

D.

Explanation:  

In combinational circuits, the current output values are always the same for the same set of input values, regardless the previous values.

We say that combinational circuits have no memory, or that the circuit has no feedback from the outputs.  

For sequential circuits, on the contrary, the current output values are not based in the current input values only, but on the previous output values as well.

So, the fact of having a defined set of input values at a given moment, doesn't guarantee which the output values will be.

We say that sequential circuits have memory, or that they have feedback from the outputs.

Examples of these type of circuits are R-S, J-K, D or T flip-flops.

4 0
3 years ago
Which of the following is not one of the steps a company would take in an attempt to prevent a malfunction or failure of their p
bulgar [2K]

Answer:

A overdesign

Explanation:

7 0
3 years ago
Que es pilar en tecnologia
Semmy [17]
Wikipedia:The thermal copper pillar bump, also known as the "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA). Unlike conventional solder bumps that provide an electrical path and a mechanical connection to the package, thermal bumps act as solid-state heat pumps and add thermal management functionality locally on the surface of a chip or to another electrical component. The diameter of a thermal bump is 238 μm and 60 μm high.

The thermal bump uses the thermoelectric effect, which is the direct conversion of temperature differences to electric voltage and vice versa. Simply put, a thermoelectric device creates a voltage when there is a different temperature on each side, or when a voltage is applied to it, it creates a temperature difference. This effect can be used to generate electricity, to measure temperature, to cool objects, or to heat them.

For each bump, thermoelectric cooling (TEC) occurs when a current is passed through the bump. The thermal bump pulls heat from one side of the device and transfers it to the other as current is passed through the material. This is known as the Peltier effect.[1] The direction of heating and cooling is determined by the direction of current flow and the sign of the majority electrical carrier in the thermoelectric material. Thermoelectric power generation (TEG) on the other hand occurs when the thermal bump is subjected to a temperature gradient (i.e., the top is hotter than the bottom). In this instance, the device generates current, converting heat into electrical power. This is termed the Seebeck effect.[1]

The thermal bump was developed by Nextreme Thermal Solutions as a method for integrating active thermal management functionality at the chip level in the same manner that transistors, resistors and capacitors are integrated in conventional circuit designs today. Nextreme chose the copper pillar bump as an integration strategy due to its widespread acceptance by Intel, Amkor and other industry leaders as the method for connecting microprocessors and other advanced electronics devices to various surfaces during a process referred to as “flip-chip” packaging. The thermal bump can be integrated as a part of the standard flip-chip process (Figure 1) or integrated as discrete devices.

The efficiency of a thermoelectric device is measured by the heat moved (or pumped) divided by the amount of electrical power supplied to move this heat. This ratio is termed the coefficient of performance or COP and is a measured characteristic of a thermoelectric device. The COP is inversely related to the temperature difference that the device produces. As you move a cooling device further away from the heat source, parasitic losses between the cooler and the heat source necessitate additional cooling power: the further the distance between source and cooler, the more cooling is required. For this reason, the cooling of electronic devices is most efficient when it occurs closest to the source of the heat generation.

Use of the thermal bump does not displace system level cooling, which is still needed to move heat out of the system; rather it introduces a fundamentally new methodology for achieving temperature uniformity at the chip and board level. In this manner, overall thermal management of the system becomes more efficient. In addition, while conventional cooling solutions scale with the size of the system (bigger fans for bigger systems, etc.), the thermal bump can scale at the chip level by using more thermal bumps in the overall design.

4 0
2 years ago
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