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zlopas [31]
3 years ago
7

How to stop sharing location without them knowing imessage.

Computers and Technology
1 answer:
Leno4ka [110]3 years ago
4 0
Answer:
Unless you delete your iMessage conversation from their phone before they look at it, this is not possible.
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What can u access various sites on
Klio2033 [76]
Search engines. (I'm Misty btw if you want to know)
3 0
3 years ago
A python programmer is writing a function definition. What syntax should be used?
Kay [80]

Answer:

<u>Syntax of function in the Python Programming Language.</u>

def function_name():

   '''body of the function or code'''

#calling of the function

function_name()

Note: In Python Programming Language, Indentation is sensitive if you not focus on the indentation then, you program occurs an indentation error.

Explanation:

In Python Programming language, we can use the "def" keyword to define a function then we write the name of the function and then use parentheses for the argument list. "#" is used for the single-line comment and " ''' ''' " is used for the multiple line comment.

A function is the part or module of the program which provides users the feature of reusability of that code anywhere only by calling them.

8 0
3 years ago
Choose all of the items that accurately describe an operating system.
Simora [160]

Answer:

provides the platform that application software runs on, manages a computer's hardware, and implements features like file and folder management.

Explanation:

6 0
3 years ago
Que es pilar en tecnologia
Semmy [17]
Wikipedia:The thermal copper pillar bump, also known as the "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA). Unlike conventional solder bumps that provide an electrical path and a mechanical connection to the package, thermal bumps act as solid-state heat pumps and add thermal management functionality locally on the surface of a chip or to another electrical component. The diameter of a thermal bump is 238 μm and 60 μm high.

The thermal bump uses the thermoelectric effect, which is the direct conversion of temperature differences to electric voltage and vice versa. Simply put, a thermoelectric device creates a voltage when there is a different temperature on each side, or when a voltage is applied to it, it creates a temperature difference. This effect can be used to generate electricity, to measure temperature, to cool objects, or to heat them.

For each bump, thermoelectric cooling (TEC) occurs when a current is passed through the bump. The thermal bump pulls heat from one side of the device and transfers it to the other as current is passed through the material. This is known as the Peltier effect.[1] The direction of heating and cooling is determined by the direction of current flow and the sign of the majority electrical carrier in the thermoelectric material. Thermoelectric power generation (TEG) on the other hand occurs when the thermal bump is subjected to a temperature gradient (i.e., the top is hotter than the bottom). In this instance, the device generates current, converting heat into electrical power. This is termed the Seebeck effect.[1]

The thermal bump was developed by Nextreme Thermal Solutions as a method for integrating active thermal management functionality at the chip level in the same manner that transistors, resistors and capacitors are integrated in conventional circuit designs today. Nextreme chose the copper pillar bump as an integration strategy due to its widespread acceptance by Intel, Amkor and other industry leaders as the method for connecting microprocessors and other advanced electronics devices to various surfaces during a process referred to as “flip-chip” packaging. The thermal bump can be integrated as a part of the standard flip-chip process (Figure 1) or integrated as discrete devices.

The efficiency of a thermoelectric device is measured by the heat moved (or pumped) divided by the amount of electrical power supplied to move this heat. This ratio is termed the coefficient of performance or COP and is a measured characteristic of a thermoelectric device. The COP is inversely related to the temperature difference that the device produces. As you move a cooling device further away from the heat source, parasitic losses between the cooler and the heat source necessitate additional cooling power: the further the distance between source and cooler, the more cooling is required. For this reason, the cooling of electronic devices is most efficient when it occurs closest to the source of the heat generation.

Use of the thermal bump does not displace system level cooling, which is still needed to move heat out of the system; rather it introduces a fundamentally new methodology for achieving temperature uniformity at the chip and board level. In this manner, overall thermal management of the system becomes more efficient. In addition, while conventional cooling solutions scale with the size of the system (bigger fans for bigger systems, etc.), the thermal bump can scale at the chip level by using more thermal bumps in the overall design.

4 0
3 years ago
Please help
MA_775_DIABLO [31]

Answer:

Key name

How to use it

Shift

Press Shift in combination with a letter to type an uppercase letter. Press Shift in combination with another key to type the symbol shown on the upper part of that key.

Caps Lock

Press Caps Lock once to type all letters as uppercase. Press Caps Lock again to turn this function off. Your keyboard might have a light indicating whether Caps Lock is on.

Tab

Press Tab to move the cursor several spaces forward. You can also press Tab to move to the next text box on a form.

Enter

Press Enter to move the cursor to the beginning of the next line. In a dialog box, press Enter to select the highlighted button.

Spacebar

Press the Spacebar to move the cursor one space forward.

Backspace

Press Backspace to delete the character before the cursor, or the selected text.

Typing (alphanumeric) keys. These keys include the same letter, number, punctuation, and symbol keys found on a traditional typewriter.

Control keys. These keys are used alone or in combination with other keys to perform certain actions. The most frequently used control keys are Ctrl, Alt, the Windows logo key  Picture of the Windows logo key, and Esc.

Function keys. The function keys are used to perform specific tasks. They are labeled as F1, F2, F3, and so on, up to F12. The functionality of these keys differs from program to program.

Navigation keys. These keys are used for moving around in documents or webpages and editing text. They include the arrow keys, Home, End, Page Up, Page Down, Delete, and Insert.

Numeric keypad. The numeric keypad is handy for entering numbers quickly. The keys are grouped together in a block like a conventional calculator or adding machine.

The following illustration shows how these keys are arranged on a typical keyboard. Your keyboard layout might be different.

Explanation:

3 0
2 years ago
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