Answer:
by leaving it out too long
Explanation:
mold forms on a piece of bread by bot eating the bread when you open something it gets old faster than not opening something.
Answer:
R aluminium = 2.63x10^-6 Ω*cm
Rcopper = 1.7 x10^-6 Ω*cm
I would use Cu as interconnections in advanced CMOS nodes.
Explanation:
the conductivity formula equals:
σ = n*g*u
n = carrier concentration
u = mobility
g = charge of carrier
The resistivity is equal to:
R = 1/σ
For the aluminium, we have:
g = 1.602x10^-19 C
R = 1/(1.98x10^23 * 1.602x10^-19 * 12 = 2.63x10^-6 Ω*cm
For copper:
R = 1/(8.5x10^22 * 1.602x10^-19 * 43.2) = 1.7 x10^-6 Ω*cm
According to the calculations found for both resistivities, I would use Cu as interconnections in advanced CMOS nodes, since copper has a lower resistivity and therefore, copper conducts electricity better.
By increasing the amount of energy produced by friction of the cloth can generate a electrical charge.
B. is pretty false my dude
Answer:
Formation of Gas, Color Change, and Absorption of heat is the Answer.
Explanation:
I just took the test.