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maks197457 [2]
3 years ago
15

The Solution Explorer window ____.

Computers and Technology
1 answer:
nataly862011 [7]3 years ago
8 0

Answer:

The correct answer for the given question is option(d).

Explanation:

Solution Explorer is found in Microsoft Visual Studio.When we create a project in the c# or another programming language the solution explorer window is used. The Solution Explorer takes care of the projects and files.  

Solution Explorer displays an overall view of the current project. In the Solution Explorer we can delete or add the file in the project. The  Solution Explorer window displays the list that is contained in the current solution.

  • Option(a),Option(b) and Option(c) are the incorrect option for the Solution Explorer window.
  • So, Option(d) is the correct answer for the solution explorer.
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The efficiency of a thermoelectric device is measured by the heat moved (or pumped) divided by the amount of electrical power supplied to move this heat. This ratio is termed the coefficient of performance or COP and is a measured characteristic of a thermoelectric device. The COP is inversely related to the temperature difference that the device produces. As you move a cooling device further away from the heat source, parasitic losses between the cooler and the heat source necessitate additional cooling power: the further the distance between source and cooler, the more cooling is required. For this reason, the cooling of electronic devices is most efficient when it occurs closest to the source of the heat generation.

Use of the thermal bump does not displace system level cooling, which is still needed to move heat out of the system; rather it introduces a fundamentally new methodology for achieving temperature uniformity at the chip and board level. In this manner, overall thermal management of the system becomes more efficient. In addition, while conventional cooling solutions scale with the size of the system (bigger fans for bigger systems, etc.), the thermal bump can scale at the chip level by using more thermal bumps in the overall design.

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Explanation:

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