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wel
3 years ago
12

There are some network modeling tools that can ________ the existing network.

Computers and Technology
2 answers:
svetlana [45]3 years ago
7 0

Answer:

There are some network modeling tools that can verify the existing network.

Explanation:

Network Modeling is an Operational Research (OP) technique that consists of a set of methods for reading business data for decision-making optimization. This technique is also considered a decision support tool, aiming at cost optimization, logistics, energy, production, among others. Within network modeling there are some network modeling tools that can verify the existing network.

lesya [120]3 years ago
4 0
<span>There are some network modeling tools that can scan the existing network.</span>
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Wikipedia:The thermal copper pillar bump, also known as the "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA). Unlike conventional solder bumps that provide an electrical path and a mechanical connection to the package, thermal bumps act as solid-state heat pumps and add thermal management functionality locally on the surface of a chip or to another electrical component. The diameter of a thermal bump is 238 μm and 60 μm high.

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The thermal bump was developed by Nextreme Thermal Solutions as a method for integrating active thermal management functionality at the chip level in the same manner that transistors, resistors and capacitors are integrated in conventional circuit designs today. Nextreme chose the copper pillar bump as an integration strategy due to its widespread acceptance by Intel, Amkor and other industry leaders as the method for connecting microprocessors and other advanced electronics devices to various surfaces during a process referred to as “flip-chip” packaging. The thermal bump can be integrated as a part of the standard flip-chip process (Figure 1) or integrated as discrete devices.

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