Answer:
See explanation
Explanation:
Electroplating involves the coating of one metal on another metal. It is an electrochemical process. The positive electrode is the coating metal while the negative electrode is the metal on which the coating is to be performed.
Since copper is to be coated on an iron nail. A copper plate is made the positive electrode while the iron nail should be the negative electrode.
The electrolyte used in the process should be a copper salt e.g CuSO4 solution.
As electrolysis progresses, the copper electrode(positive electrode or anode) gradually wears away due to the fact that the copper ions are going into the solution and are being deposited on the iron nail.
Answer : The dissociation constant of the PFK‑inhibitor complex is, 5 µM
Explanation :
The expression for reversible competitive inhibition when apparent Km affected by addition of the inhibitor is:
![K_m_a=K_m[1+\frac{I}{K_i}]](https://tex.z-dn.net/?f=K_m_a%3DK_m%5B1%2B%5Cfrac%7BI%7D%7BK_i%7D%5D)
where,
= apparent value = 52 µM
= Michaelis–Menten constant = 40 µM
I = inhibitor concentration = 1.5 µM
= dissociation constant of the PFK‑inhibitor complex
Now put all the given values in the above formula, we get:
![52\mu M=40\mu M[1+\frac{1.5\mu M}{K_i}]](https://tex.z-dn.net/?f=52%5Cmu%20M%3D40%5Cmu%20M%5B1%2B%5Cfrac%7B1.5%5Cmu%20M%7D%7BK_i%7D%5D)
Therefore, the dissociation constant of the PFK‑inhibitor complex is, 5 µM
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"A. Natural resources and human labour".
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