Answer:
P=361.91 KN
Explanation:
given data:
brackets and head of the screw are made of material with T_fail=120 Mpa
safety factor is F.S=2.5
maximum value of force P=??
<em>solution:</em>
to find the shear stress
T_allow=T_fail/F.S
=120 Mpa/2.5
=48 Mpa
we know that,
V=P
<u>Area for shear head:</u>
A(head)=π×d×t
=π×0.04×0.075
=0.003×πm^2
<u>Area for plate:</u>
A(plate)=π×d×t
=π×0.08×0.03
=0.0024×πm^2
now we have to find shear stress for both head and plate
<u>For head:</u>
T_allow=V/A(head)
48 Mpa=P/0.003×π ..(V=P)
P =48 Mpa×0.003×π
=452.16 KN
<u>For plate:</u>
T_allow=V/A(plate)
48 Mpa=P/0.0024×π ..(V=P)
P =48 Mpa×0.0024×π
=361.91 KN
the boundary load is obtained as the minimum value of force P for all three cases. so the solution is
P=361.91 KN
note:
find the attached pic
Answer:
a) 0.684
b) 0.90
Explanation:
Catalyst
EO + W → EG
<u>a) calculate the conversion exiting the first reactor </u>
CAo = 16.1 / 2 mol/dm^3
Given that there are two stream one contains 16.1 mol/dm^3 while the other contains 0.9 wt% catalyst
Vo = 7.24 dm^3/s
Vm = 800 gal = 3028 dm^3
hence Im = Vin/ Vo = (3028 dm^3) / (7.24dm^3/s) = 418.232 secs = 6.97 mins
next determine the value of conversion exiting the reactor ( Xai ) using the relation below
KIm = 
------ ( 1 )
make Xai subject of the relation
Xai = KIm / 1 + KIm --- ( 2 )
<em>where : K = 0.311 , Im = 6.97 ( input values into equation 2 )</em>
Xai = 0.684
<u>B) calculate the conversion exiting the second reactor</u>
CA1 = CA0 ( 1 - Xai )
therefore CA1 = 2.5438 mol/dm^3
Vo = 7.24 dm^3/s
To determine the value of the conversion exiting the second reactor ( Xa2 ) we will use the relation below
XA2 = ( Xai + Im K ) / ( Im K + 1 ) ----- ( 3 )
<em> where : Xai = 0.684 , Im = 6.97, and K = 0.311 ( input values into equation 3 )</em>
XA2 = 0.90
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Answer:
(A) elemental, alloy, or compound thin films are deposited on to a bulk substrate
Explanation:
In film deposition there is process of depositing of material in form of thin films whose size varies between the nano meters to micrometers onto a surface. The material can be a single element a alloy or a compound.
This technology is very useful in semiconductor industries, in solar panels in CD drives etc
so from above discussion it is clear that option (a) will be the correct answer
Answer:
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