They all consist of Hydroxide particles (OH)
and they produce hydroxide ions (OH-) when placed in water/aqueous solution.
Answer:
A) a new type of refrigerant that is less damaging to the environment is developed. Applied development
B) a new element is synthesized in a particle accelerator. Basic development.
C) a computer is redesigned to increase the speed of the computer. Technological development.
Explanation:
To get the melting point of a solution so, we will use this formula:
ΔT = - mKf
when:
m is molality of the solution
Kf is cryoscopic constant of water = 1.86 C/m
and ΔT is the change in melting point (T2 - 0 °C)
so, now we need to calculate the molality to substitute:
when the molality = moles NaCl / Kg of water
and when moles NaCl = mass / molar mass
= 2.5 g / 58 g/mol
= 0.043 mol
∴ Kg water = volume *density /1000
= 230 mL * 1 g/mL / 1000
= 0.23 Kg
∴ molality = 0.043 / 0.23 =0.187 M
by substitution:
T2-0°C = - 0.187 * 1.86
∴T2 = - 0.348 °C
C. The design would not be cost-efficient; the plane would require more fuel due to increased thrust from higher drag.
Sample means for solutions 1 and 2 are 19.27 and 10.32 respectively
In semiconductor manufacturing,
The total for answer 1 is given by:
9.7+10.5+9.4+10.6+9.3+10.7+9.6+10.4+10.2+10.5 = 192.7
The sample size is 10 and provides us with
192.7/10 = 19.27
For solution 2, the sum is given by:
10.6+10.3+10.3+10.2+10.0+10.7+10.3+10.4+10.1+10.3 = 103.2
The sample size is 10, this gives us
103.2/10 = 10.32
The total for answer 2 is given by:
10.6+10.3+10.3+10.2+10.0+10.7+10.3+10.4+10.1+10.3 = 103.2
The sample size is 10 and provides us with
103.2/10 = 10.32
Learn more about semiconductor manufacturing here brainly.com/question/22779437
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In semiconductor manufacturing, wet chemical etching is often used to remove silicon from the backs of wafers prior to metalization. The etch rate is an important characteristic in this process and is known to follow a normal distribution. Two different etching solutions have been compared, using two random samples of 10 wafers for each solution. Assume the variances are equal. The etch rates are as follows (in mils per minute): Solution 1 Solution 2 9.7 10.6 10.5 10.3 9.4 10.3 10.6 10.2 9.3 10.0 10.7 10.7 9.6 10.3 10.4 10.4 10.2 10.1 10.5 10.3 Calculate sample means of solution 1 and solution 2
