Which of the following is Microsoft Windows 10 virtualization technology?

25 points select 3 options!!!!!!!!!!!!!!!!!!!!!!!!!

Veronika [31]

Answer: don't know sorry

Explanation:

5 0

2 years ago

Read 2 more answers

How to do the for loop in python

shusha [124]

Answer:

To loop through a set of code a specified number of times, we can use the range() function, The range() function returns a sequence of numbers, starting from 0 by default, and increments by 1 (by default), and ends at a specified number.

Explanation:

hope this helps

8 0

2 years ago

NIST recommends selecting cloud providers that support strong encryption, have appropriate redundancy mechanisms in place, emplo

WITCHER [35]

Answer:

The answer is "Option a".

Explanation:

In cloud computing, it is also known as the model, that enables you for accessible, convenient, through the-demand network access to global computer resources, which can be rapid to get and published via low administrative effort.

Its recommending selection for the cloud providers support for the robust encryption, that has adequate replication processes in place, use user authentication, or provide ample clarity to customers regarding mechanisms that defend subscriptions against other subscriptions and the supplier.

8 0

3 years ago

In this assignment, you will design and create an ArrayList-based application that manages a collection of DVDs. Information abo

sergij07 [2.7K]

Create and design an arraylist based application which manages a DVDs collection.

Explanation:

DVD movie consists of a title, a rating (e.g. PG, R, etc.), and a running time in minutes.

In this project, you will create an application to allow the user to maintain a collection of DVD movies using an array.

When the application starts up, it will read in the DVD data from a text file to initialize the array, if the file is available. If the file is not there, then the program starts with an empty array. If the file is corrupted (has an invalid or missing value), then the program stops its initialization at the point of the error. The data file should contain one DVD per line, with title followed by rating followed by running time in minutes, all separated by commas. You may assume titles are all in uppercase and do not contain commas. For example:

ANGELS AND DEMONS,PG-13,138

STAR TREK,R,127

UP,PG,96

The titles may not be in alphabetical order, but the DVDs should be inserted into the array in alphabetical order.

The application will then allow its user to perform the following operations:

ADD OR MODIFY DVD - The user will be prompted to enter the title, rating and running time (in minutes) for a DVD. If the title is already in the array, then the rating and running time are updated to the supplied values. If the title is not in the array, a DVD is added to the array so that the array is sorted by title. Convert all titles to uppercase only.

REMOVE DVD - The user will be prompted to enter the title of a DVD. If the title is in the array, then the DVD is removed, shifting subsequent DVDs over one position to fill in the gap left by the removed DVD. Again, titles must match exactly (in uppercase).

GET DVDs BY RATING - The user will be prompted to enter a movie rating (e.g. PG). This operation displays a string containing all DVDs matching the given rating in the order that they appear in the DVD collection, separated by newline characters.

GET TOTAL RUNNING TIME - This operation displays the total running time of all DVDs in the collection for the user.

SAVE & EXIT - The user can quit the program, performing an automatic save if the DVD collection has been modified.

Java Files

DVD.java - A class to model a single DVD, including its title, rating and total running time.

DVDCollection.java - A class to model a collection of DVDs using an array.

DVDUserInterface.java - An interface that describes the operation required for any user interface to this DVD collection.

DVDGUI.java - A class that implements the DVDUserInterface interface and provides a graphical user interface to the DVD collection.

DVDConsoleUI.java - A class that implements the DVDUserInterface interface and provides a console user interface to the DVD collection.

DVDManager.java - A class that contains a main method that launches one of the two user interfaces for the user to work with the DVD collection based on the user input.

Complete the DVD class by completing the given methods (constructor, accessors and mutators). Add javadoc comments so you can generate a javadoc documentation file showing how to use this class.

The DVDCollection class uses an array to maintain the collection of DVDs. The DVDs should be stored in alphabetical order based on title starting at position 0 in the array, using adjacent cells. All titles should be stored in uppercase only and are assumed to be unique (no duplicates).

toString - returns a string containing all of the DVDs in the collection, separated by newlines characters, along with the value of numdvds and the length of the DVD array for debugging purposes. The string should be formatted as shown in the example below:

numdvds = 3

dvdArray.length = 7

dvdArray[0] = ANGELS AND DEMONS/PG-13/138min

dvdArray[1] = STAR TREK/R/127min

dvdArray[2] = UP/PG/96min

addOrModifyDVD - given the title, rating and running time of a DVD, add this DVD to the collection if the title is not present in the DVD collection or modify the DVD's rating and running time if the title is present in the collection.insert the DVD so that all DVDs are in alphabetical order by title.

removeDVD - given the title, this method should remove the DVD with this title from the collection if present. The title must match exactly (in uppercase). If no title matches, do not change the collection.

getDVDsByRating - given the rating, this method should return a string containing all DVDs that match the given rating in the order that they appear in the collection, separated by newlines.

getTotalRunningTime - this method should return the total running time of all DVDs in the collection. If there are no DVDs in the collection, return 0.

loadData - given a file name, this method should try to open this file and read the DVD data contained inside to create an initial alphabetized DVD collection.

save - save the DVDs currently in the array into the same file specified during the load operation, overwriting whatever data was originally there.

7 0

3 years ago

Que es pilar en tecnologia

Semmy [17]

Wikipedia:The thermal copper pillar bump, also known as the "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA). Unlike conventional solder bumps that provide an electrical path and a mechanical connection to the package, thermal bumps act as solid-state heat pumps and add thermal management functionality locally on the surface of a chip or to another electrical component. The diameter of a thermal bump is 238 μm and 60 μm high.

The thermal bump uses the thermoelectric effect, which is the direct conversion of temperature differences to electric voltage and vice versa. Simply put, a thermoelectric device creates a voltage when there is a different temperature on each side, or when a voltage is applied to it, it creates a temperature difference. This effect can be used to generate electricity, to measure temperature, to cool objects, or to heat them.

For each bump, thermoelectric cooling (TEC) occurs when a current is passed through the bump. The thermal bump pulls heat from one side of the device and transfers it to the other as current is passed through the material. This is known as the Peltier effect.[1] The direction of heating and cooling is determined by the direction of current flow and the sign of the majority electrical carrier in the thermoelectric material. Thermoelectric power generation (TEG) on the other hand occurs when the thermal bump is subjected to a temperature gradient (i.e., the top is hotter than the bottom). In this instance, the device generates current, converting heat into electrical power. This is termed the Seebeck effect.[1]

The thermal bump was developed by Nextreme Thermal Solutions as a method for integrating active thermal management functionality at the chip level in the same manner that transistors, resistors and capacitors are integrated in conventional circuit designs today. Nextreme chose the copper pillar bump as an integration strategy due to its widespread acceptance by Intel, Amkor and other industry leaders as the method for connecting microprocessors and other advanced electronics devices to various surfaces during a process referred to as “flip-chip” packaging. The thermal bump can be integrated as a part of the standard flip-chip process (Figure 1) or integrated as discrete devices.

The efficiency of a thermoelectric device is measured by the heat moved (or pumped) divided by the amount of electrical power supplied to move this heat. This ratio is termed the coefficient of performance or COP and is a measured characteristic of a thermoelectric device. The COP is inversely related to the temperature difference that the device produces. As you move a cooling device further away from the heat source, parasitic losses between the cooler and the heat source necessitate additional cooling power: the further the distance between source and cooler, the more cooling is required. For this reason, the cooling of electronic devices is most efficient when it occurs closest to the source of the heat generation.

Use of the thermal bump does not displace system level cooling, which is still needed to move heat out of the system; rather it introduces a fundamentally new methodology for achieving temperature uniformity at the chip and board level. In this manner, overall thermal management of the system becomes more efficient. In addition, while conventional cooling solutions scale with the size of the system (bigger fans for bigger systems, etc.), the thermal bump can scale at the chip level by using more thermal bumps in the overall design.

4 0

3 years ago