Answer:
Explanation:
The vessel is modelled after the First Law of Thermodynamics. Let suppose the inexistence of mass interaction at boundary between vessel and surroundings, changes in potential and kinectic energy are negligible and vessel is a rigid recipient.
Properties of water at initial and final state are:
State 1 - (Liquid-Vapor Mixture)
State 2 - (Liquid-Vapor Mixture)
The mass stored in the vessel is:
The heat transfer require to the process is:
Answer:
Sound barrier.
Explanation:
Sound barrier is a sudden increase in drag and other effects when an aircraft travels faster than the speed of sound. Other undesirable effects are experienced in the transonic stage, such as relative air movement creating disruptive shock waves and turbulence. One of the adverse effect of this sound barrier in early plane designs was that at this speed, the weight of the engine required to power the aircraft would be too large for the aircraft to carry. Modern planes have designs that now combat most of these undesirable effects of the sound barrier.
Answer: The net force in every bolt is 44.9 kip
Explanation:
Given that;
External load applied = 245 kip
number of bolts n = 10
External Load shared by each bolt (P_E) = 245/10 = 24.5 kip
spring constant of the bolt Kb = 0.4 Mlb/in
spring constant of members Kc = 1.6 Mlb/in
combined stiffness factor C = Kb / (kb+kc) = 0.4 / ( 0.4 + 1.6) = 0.4 / 2 = 0.2 Mlb/in
Initial pre load Pi = 40 kip
now for Bolts; both pre load Pi and external load P_E are tensile in nature, therefore we add both of them
External Load on each bolt P_Eb = C × PE = 0.2 × 24.5 = 4.9 kip
So Total net Force on each bolt Fb = P_Eb + Pi
Fb = 4.9 kip + 40 kip
Fb = 44.9 kip
Therefore the net force in every bolt is 44.9 kip
Answer:
(A) elemental, alloy, or compound thin films are deposited on to a bulk substrate
Explanation:
In film deposition there is process of depositing of material in form of thin films whose size varies between the nano meters to micrometers onto a surface. The material can be a single element a alloy or a compound.
This technology is very useful in semiconductor industries, in solar panels in CD drives etc
so from above discussion it is clear that option (a) will be the correct answer
