Answer:
The explanations are provided below.
Explanation:
a) The accelerated thermal cycling test is a test that is performed to evaluate the fatigue strength of electronic solder connections. The glass transition temperature given as
is a frequently used parameter to test the degree of cure of an epoxy encapsulant.
b) The Coefficient of Thermal Expansion of Encapsulant
This is an important parameter to prevent crackling. Crackling occurs when a joint is subjcted to high temperatures during reflow soldering. Thus, the property is important in determining the limits of the joint.
Answer:
the critical flaw length is 10.06 mm
Explanation:
Given the data in the question;
plane strain fracture toughness
= 92 Mpa√m
yield strength σ
= 900 Mpa
design stress is one-half of the yield strength ( 900 Mpa / 2 ) 450 Mpa
Y = 1.15
we know that;
Critical crack length
= 1/π(
/ Yσ )²
we substitute
= 1/π( 92 Mpa√m / (1.15 × 450 Mpa )²
= 1/π( 92 Mpa√m / (517.5 Mpa )²
= 1/π( 0.177777 )²
= 1/π( 0.03160466 )
= 0.01006 m = 10.06 mm
Therefore, the critical flaw length is 10.06 mm
{
= ( 10.06 mm ) > 3 mm
The critical flow is subject to detection
Answer:
Their feathers are light and the shape of their wings is perfect for catching the air. Their lungs are great at getting oxygen and very efficient, so they can fly for very long distances without getting tired. They eat lots of high-energy food.