This upgrade will make a big improvement from his AMD Athalon X4 950 to the AMD Ryzen 7 2700X this is because the system will have more gigabytes and a better processor
Answer:
Abstraction is the process of removing or taking away certain characteristics to reduce or hide several very important characteristics.
In OOP (Object Oriented Programming), to increase efficiency and reduce complexity, a programmer hides certain vital data about an object. This is abstraction in programming.
For further clarification, a programmer ensures that the name given to an entity makes sense and most importantly, that it carries relevant aspects, and non essential parts are not included.
Answer:
The main difference between the c and the C++ programming language are as follows:
- The C language is the type of procedure programming language and on the other hand, C++ is the combination of object oriented (OOPS) and the procedure programming language.
- The C programming language does not support any type of object and class in the system. While the C++ programming language is also known as hybrid programming language.
- The C programming language does not support any type of operator overloading and function. On the other hand, the C++ programming language supported both the function overloading and the function.
The security protocol for wireless networks attempts to establish the same security for them as would be present in a wired network is WEP. The correct option is A.
<h3>What is WEP?</h3>
Wired Equivalent Privacy (WEP) is a security protocol defined by the IEEE 802.11b Wireless Fidelity (Wi-Fi) standard.
That standard is intended to provide a wireless local area network (WLAN) with security and privacy comparable to that of a wired LAN.
WEP is a wireless network security protocol that attempts to provide the same level of security as a wired network.
Thus, the correct option is A.
For more details regarding WEP, visit:
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Your question seems incomplete, the missing options are:
A. WEP
B. WEB
C. WELL
D. WALL
Answer:
C-DIP: Ceramic Dual In-line Package.
CERDIP: Ceramic DIP, which is the same as C-DIP.
CPGA: Ceramic Pin Grid Array.
DIL: Dual In-Line; see note below.
DIP: Dual In-line Package; DIP Socket Styles.
TBD: Dual In-line Zig-Zag Package; Zig-Zag Package.
HDIP: Hermetic DIP.
PDIP: Plastic DIP [P-DIP]
Explanation:
