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Sladkaya [172]
2 years ago
12

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Engineering
1 answer:
vodka [1.7K]2 years ago
5 0

Answer:

(⌐■-■) (⌐■-■) (⌐■-■) (⌐■-■)

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Air at 400kPa, 970 K enters a turbine operating at steady state and exits at 100 kPa, 670 K. Heat transfer from the turbine occu
Sonja [21]

Answer:

a

The rate of work developed is \frac{\r W}{\r m}= 300kJ/kg

b

The rate of entropy produced within the turbine is   \frac{\sigma}{\r m}=  0.0861kJ/kg \cdot K

Explanation:

     From  the question we are told

          The rate at which heat is transferred is \frac{\r Q}{\r m } = -  30KJ/kg

the negative sign because the heat is transferred from the turbine

          The specific heat capacity of air is c_p = 1.1KJ/kg \cdot K

          The inlet temperature is  T_1 = 970K

          The outlet temperature is T_2 = 670K

           The pressure at the inlet of the turbine is p_1 = 400 kPa

          The pressure at the exist of the turbine is p_2 = 100kPa

           The temperature at outer surface is T_s = 315K

         The individual gas constant of air  R with a constant value R = 0.287kJ/kg \cdot K

The general equation for the turbine operating at steady state is \

               \r Q - \r W + \r m (h_1 - h_2) = 0

h is the enthalpy of the turbine and it is mathematically represented as          

        h = c_p T

The above equation becomes

             \r Q - \r W + \r m c_p(T_1 - T_2) = 0

              \frac{\r W}{\r m}  = \frac{\r Q}{\r m} + c_p (T_1 -T_2)

Where \r Q is the heat transfer from the turbine

           \r W is the work output from the turbine

            \r m is the mass flow rate of air

             \frac{\r W}{\r m} is the rate of work developed

Substituting values

              \frac{\r W}{\r m} =  (-30)+1.1(970-670)

                   \frac{\r W}{\r m}= 300kJ/kg

The general balance  equation for an entropy rate is represented mathematically as

                       \frac{\r Q}{T_s} + \r m (s_1 -s_2) + \sigma  = 0

          =>          \frac{\sigma}{\r m} = - \frac{\r Q}{\r m T_s} + (s_1 -s_2)

    generally (s_1 -s_2) = \Delta s = c_p\ ln[\frac{T_2}{T_1} ] + R \ ln[\frac{v_2}{v_1} ]

substituting for (s_1 -s_2)

                      \frac{\sigma}{\r m} = \frac{-\r Q}{\r m} * \frac{1}{T_s} +  c_p\ ln[\frac{T_2}{T_1} ] - R \ ln[\frac{p_2}{p_1} ]

                      Where \frac{\sigma}{\r m} is the rate of entropy produced within the turbine

 substituting values

                \frac{\sigma}{\r m} = - (-30) * \frac{1}{315} + 1.1 * ln\frac{670}{970} - 0.287 * ln [\frac{100kPa}{400kPa} ]

                    \frac{\sigma}{\r m}=  0.0861kJ/kg \cdot K

           

 

                   

   

5 0
3 years ago
Heather is troubleshooting a computer at her worksite. She has interviewed the computer’s user and is currently trying to reprod
Luba_88 [7]

Answer:

The correct option is A

Explanation:

Heather is trying to establish a theory of probable cause. In this step of the troubleshooting process, the person troubleshooting questions the obvious and then test the theory or response given by the user to really determine the cause. Once confirmation of this theory has been achieved, the troubleshooter then tries to establish a resolution to the problem. However in the event whereby the theory is not confirmed, the troubleshooter then tries to establish a new theory.

8 0
3 years ago
120 litres of water is discharge from container in 25 seconds. Find the rate of discharge in cumecs.if the discharge took place
notsponge [240]
<h2>Answer:</h2>

Rate of discharge in cumecs: <u>0.0048m³/s</u>.

Velocity flow: <u>24m/s</u>.

<h2>Explanation:</h2>

<h3>1. Find the rate of discharge in cumecs.</h3>

a. Convert from litres to m³.
120L*1000= 120000mL

120000mL=120000cm³

120000cm³/100³=0.12 m³.

b. Rate of discharge.

<em>If  0.12 m³ where discharged in 25 seconds, the rate of discharge is:</em>

0.12m³/25s = 0.0048m³/s.

<em />

<em />

<h3>2. Find the velocity flow.</h3>

Let's refer to the fluid mechanics equation that relates volume flow, area and velocity. This is the formula:

\frac{dV}{dt}=Av; where the expression \frac{dV}{dt} is the volume flow rate (in m³/s); A is the cross-sectional area of the pipe (in m²), and v is the velocity flow (in m/s).

a. Solve the equation for v.

\frac{dV}{dt}=Av\\ \\(\frac{dV}{dt})/A=v\\ \\v=(\frac{dV}{dt})/A

b. Calculate the cross-sectional area of the pipe.

<em>The cross-sectional area of the pipe is a circle. Hence, the formula of this area is:</em>

A=\pi r^{2}

<em>We'll have to convert the diameter to meters, because the formula for flow velocity needs the area in m². Let's go ahead and do that.</em>

<em />50mm/1000=0.05m.

<em>We were given the diameter, and the formula uses the radius, but the radius is just half of the diameter, therefore, we can substitute in toe formula like this:</em>

A=\pi (\frac{0.05}{2} )^{2}=0.0020m^{2}

c. Substitute in the new expression for velocity flow and calculate.

v=(\frac{dV}{dt})/A\\ \\v=(\frac{0.048m^{3} }{1s})/(0.0020m^{2} )\\\\ v= 24m/s

8 0
2 years ago
What is land administration and cadastral survey
vaieri [72.5K]

Cadastral surveying is the sub-field of cadastre and surveying that specialises in the establishment and re-establishment of real property boundaries. ... A cadastral surveyor must apply both the spatial-measurement principles of general surveying and legal principles such as respect of neighboring titles.

8 0
3 years ago
Describe the basic mechanism by which positive photolithography transfers a pattern, and comment on the chemical interactions of
ankoles [38]

Photo-lithography is the method of giving geometric shapes on a mask to the surface of a silicon wafer.

<u>Explanation:</u>

The fabrication of an integrated circuit (IC) requires a variety of physical and chemical processes conducted on a semiconductor (e.g., silicon) substrate. In common, the numerous methods used to create an IC fall into three divisions: film deposition, patterning, and semiconductor doping.

Films from both conductors (such as polysilicon, aluminum, and extended recently copper) and nonconductors (various forms of silicon dioxide, silicon nitride, and others) are utilized to combine and separate transistors and their parts.

Selective doping of different regions of silicon permits the conductivity of the silicon to be altered with the application of voltage. By building structures of these various parts millions of transistors can be assembled and wired together to form the complex circuitry of a modern microelectronic device.  

Fundamental to all of these methods is lithography, i.e., the development of three-dimensional relief images on the substrate for subsequent transfer of the model to the substrate.

6 0
3 years ago
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