Answer:
a) 100%
b) 300%
c) 301 %
Explanation:
The first wafer has a diameter of 150 mm.
The second wafer has a diameter of 300 mm.
The second wafer has an increase in diameter respect of the first of:
((300 / 150) - 1) * 100 = 100%
The first wafers has a processable area of:
A1 = π/4 * D1^2
The scond wafer has a processable area of:
A2 = π/4 * D2^2
The seconf wafer has a increase in area respect of the first of:
(A2/A1 * - 1) * 100
((π/4 * D2^2) / (π/4 * D1^2) - 1) * 100
((D2^2) / (D1^2) - 1) * 100
((300^2) / (150^2) - 1) * 100 = 300%
The area of a chip is
Ac = Lc^2
So the chips that can be made from the first wafer are:
C1 = A1 / Ac
C1 = (π/4 * D1^2) / Lc^2
C1 = (π/4 * 150^2) / 10^2 = 176.7
Rounded down to 176
The chips that can be made from the second wafer are:
C2 = A2 / Ac
C2 = (π/4 * D2^2) / Lc^2
C2 = (π/4 * 300^2) / 10^2 = 706.8
Rounded down to 706
The second wafer has an increase of chips that can be made from it respect of the first wafer of:
(C2 / C1 - 1) * 100
(706 / 176 - 1) *100 = 301%
