Answer:
Explanation:
The rank of the magnitude of the diffusion coefficient from greatest to least is as follows:
C in Fe at 900°C > Cr in Fe at 900°C > Cr in Fe at 600°C
Reason
C in Fe is an interstitial impurity while Cr in Fe is a substutional impurity.Therefore interstitial impurity occurs in C in Fe systems,while substutitional diffusion occurs in Cr in Fe system.Interstitial is much faster than substitutional diffusion hence the order
Also with increasing temperature magnitude of diffusion coefficient increases,due to the relation.
D = D₀exp(-Qd/RT)
Where D₀=Temperature independent per exponential
Qd= The activation energy for diffusion
R= Universal gas constant
T=absolute temperature
Answer:
7
Explanation:
The structure of memory chip is given by multiplying the number of rows and column ie M X N
he number of address line required for row decoder is n where M =
or expressed in logarithmic form we have
In this case M=N since number of rows is equal to the number of columns
Therefore, 
Therefore,
M=128
Since 
Therefore, address lines should be at least 7
During the discharge ions combine with anode to form a compound and release one or more electron.
Answer:
Evaluate the required thickness of styrofoam for the freezer compartment in the previous problem when the inside wall is exposed to air at -10°C through a surface coefficient of 16 W/m2 · K and the outer wall is exposed to 33°C air with a surface coefficient of 32 W/m2 · K. Determine the surface temperatures for this situation.
Explanation:
Answer:
Most commonly used air flow proving interlocks are:
- differential pressure air flow switch. Contact changes state based on duct static vs. atmosphere outside the duct or dp across a fan inlet to outlet
- CT relay. Current transformer relay that changes state from 0 to 1 open/closed when amp draw on a blower motor exceeds the trip setpoint.
Explanation:
