An array of electronic chips is mounted within a sealedrectangular enclosure, and colling is implemented by attaching analuminum
heat sink (k=180 W/m*K). The base of the heat sinkhas dimensions of w1=w2=100mm, while the 6 fins are of thicknesst=10mm and pitch S=18mm. The fin length is Lf=50 mm, and thebase of the heat sink has a thickness of Lb=10mm.
If cooling is implemented by water flow through the heat sink,with u[infinity]=3 m/s and T[infinity]=17 C, what is the base temperatureTb of the heat sink when the power dissipation by the chips isPelec=1800W? The average convection coefficient for surfacesof the fins and the exposed base may be estimated by assumingparallel flow over a flat plate. Properties of the water maybe approximated as k=0.62 W/m*K, ν=7.73E-7 m2/s, andPr=5.2.
If cooling is implemented by water flow through the heat sink,with u[infinity]=3 m/s and T[infinity]=17 C, what is the base temperatureTb of the heat sink when the power dissipation by the chips isPelec=1800W? The average convection coefficient for surfacesof the fins and the exposed base may be estimated by assumingparallel flow over a flat plate. Properties of the water maybe approximated as k=0.62 W/m*K, ν=7.73E-7 m2/s, andPr=5.2.
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Given:
size of scale model = 4(size of pump)
power ratio of pump and scale model = 5:1
Solution:
Let the diameter of scale model and pump be and
respectively
and head be and
respectively
Now, power, P is given as a function of head(H) and dischagre(Q)
P = (1)
From eqn (1):
and
So,
Therefore,
=
=
=
=
=