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enot [183]
3 years ago
7

Yall pls help me out

Engineering
1 answer:
atroni [7]3 years ago
8 0

Answer:

M·L/T²

Explanation:

The given equation for <em>T</em> is presented as follows;

T = \dfrac{M \cdot V^2 \cdot A}{L^3}

Where;

m = Mass with dimension M

V = Velocity, having the dimensions L/T

A = Area, having the dimensions L²

l = Length, having the dimensions, L

Therefore;

The \ dimensions \ of \ T = \dfrac{M \times (L/T)^2 \cdot L^2}{L^3} =  \dfrac{M \times L^4/T^2 }{L^3} = M \cdot L/T^2

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Hi, any kind of help on these questions will be appreciated.
Zielflug [23.3K]

Answer:

IDK

Explanation:

8 0
3 years ago
Briefly discuss if it would be better to operate with pumps in parallel or series and how your answer would change as the steepn
Aleksandr [31]

Answer:

1) In series, the combined head will move from point 1 to point 2 in theory. However, practically speaking, the combined head and flow rate will move along the system curve to point 3.

2) In parallel, the combined head and volume flow will move along the system curve from point 1 to point 3.

Explanation:

1) Pump in series:

When two or more pumps are connected in series, their resulting pump performance curve will be obtained by adding their respective heads at the same flow rate as shown in the first diagram attached.

In the first diagram, we have 3 curves namely:

- system curve

- single pump curve

- 2 pump in series curve

Also, we have points labeled 1, 2 and 3.

- Point 1 represents the point that the system operates with one pump running.

- Point 2 represents the point where the head of two identical pumps connected in series is twice the head of a single pump flowing at the same rate.

- Point 3 is the point where the system is operating when both pumps are running.

Now, since the flowrate is constant, the combined head will move from point 1 to point 2 in theory. However, practically speaking, the combined head and flow rate will move along the system curve to point 3.

2) Pump in parallel:

When two or more pumps are connected in parallel, their resulting pump performance curve will be obtained by adding their respective flow rates at same head as shown in the second diagram attached.

In the second diagram, we have 3 curves namely:

- system curve

- single pump curve

- 2 pump in series curve

Also, we have points labeled 1, 2 and 3

- Point 1 represents the point that the system operates with one pump running.

- Point 2 represents the point where the flow rate of two identical pumps connected in series is twice the flow rate of a single pump.

- Point 3 is the point where the system is operating when both pumps are running.

In this case, the combined head and volume flow will move along the system curve from point 1 to point 3.

5 0
3 years ago
Zachary finished an internship as a Software Quality Assurance Engineer. For which job is he best qualified?
astra-53 [7]

Answer:

B. A software development firm needs someone to find and fix bugs on multiple computer platforms.

Explanation:

A software quality assurance engineer is someone who monitors every phase of the software development process so as to ensure design quality, making sure that the software adheres to the standards set by the development company. Finding bugs would make this intern a amazing bug finder

6 0
3 years ago
Read 2 more answers
A square silicon chip (k = 152 W/m·K) is of width 7 mm on a side and of thickness 3 mm. The chip is mounted in a substrate such
Harrizon [31]

Answer:

The steady-state temperature difference is 2.42 K

Explanation:

Rate of heat transfer = kA∆T/t

Rate of heat transfer = 6 W

k is the heat transfer coefficient = 152 W/m.K

A is the area of the square silicon = width^2 = (7/1000)^2 = 4.9×10^-5 m^2

t is the thickness of the silicon = 3 mm = 3/1000 = 0.003 m

6 = 152×4.9×10^-5×∆T/0.003

∆T = 6×0.003/152×4.9×10^-5 = 2.42 K

7 0
3 years ago
Considering the analogy between electrical circuit and thermal circuit, show your approach to derive an expression for the therm
Simora [160]

Answer:

Thermal resistance for a wall depends on the material, the thickness of the wall and the cross-section area.

Explanation:

Current flow and heat flow are very similar when we are talking about 1-dimensional energy transfer. Attached you can see a picture we can use to describe the heat flow between the ends of the wall. First of all, a temperature difference is required to flow heat from one side to the other, just like voltage is required for current flow.  You can also see that R_{th} represents the thermal resistance. The next image explains more about the parameters which define the value of the thermal resistances which are the following:

  1. Wall Thickness.  More thickness, more thermal resistance.
  2. Material thermal conductivity (unique value for each material). More conductivity, less thermal resistance.
  3. Cross-section Area. More cross-section area, less thermal resistance.

A expression to define  the thermal resistance for the wall is as follows:  R_{th} =\frac{l}{Ak}, where  l is the distance between the tow sides of the wall, that is to say the wall thickness; A is the cross-section area and k is the material conducitivity.

5 0
3 years ago
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