The three exposure techniques in photolithography are:
- Contact
- Proximity
- Projection
Alternatives to photolithography in IC processing include;
- X-ray
- UV
- Ion, and
- Electron lithography
<h3>
What is Photolithography?</h3>
Photolithography is a term in integrated circuit development that describes the patterned films that are formed when a beam of light falls on a substance.
This phenomenon protects the surface of sensitive materials such as glass during some operations like etching. UV and X-rays can be used for this purpose.
Learn more about photolithography here:
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Answer:
Reduce manufacturing costs.
Explanation:
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Have A Great Day
Answer:
I do i do it everyday
Explanation:
Press windows and prt sc at the same time
Answer:
C. UNDP or World Bank.
Explanation:
Suppose the country of Bangladesh wants a low interest loan to invest in the building of infrastructure. The international organizations which Bangladesh would most likely turn to are UNDP or World Bank.
Answer: Partial pressures are 0.6 MPa for nitrogen gas and 0.4 MPa for carbon dioxide.
Explanation: <u>Dalton's</u> <u>Law</u> <u>of</u> <u>Partial</u> <u>Pressure</u> states when there is a mixture of gases the total pressure is the sum of the pressure of each individual gas:
The proportion of each individual gas in the total pressure is expressed in terms of <u>mole</u> <u>fraction</u>:
= moles of a gas / total number moles of gas
The rigid tank has total pressure of 1MPa.
molar mass = 14g/mol
mass in the tank = 2000g
number of moles in the tank: = 142.85mols
molar mass = 44g/mol
mass in the tank = 4000g
number of moles in the tank: = 90.91mols
Total number of moles: 142.85 + 90.91 = 233.76 mols
To calculate partial pressure:
For Nitrogen gas:
= 0.6
For Carbon Dioxide:
0.4
Partial pressures for N₂ and CO₂ in a rigid tank are 0.6MPa and 0.4MPa, respectively.