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Keith_Richards [23]
3 years ago
8

"One step in the manufacture of silicon wafers used in the microelectronics industry is the melt crystallization of silicon into

a crystalline silicon ingot. This processis carried out within a special furnace. When the newly solidified ingot is removed from the furnace, it is assumed to have a uniform initial temperature of 1600 K, which is below the crystallization temperature. At this temperature, the thermal conductivity of silicon is 22 W/(m•K), the density is 2300 kg/m3, and the heat capacity is 1000 J/(kg•K). The hot solid silicon ingot is allowed to cool in air maintained at a constant ambient temperature of 30°C. The diameter of the silicon rod is 15 cm. End effects are considered negligible. The convective heat transfer coefficient is 147 W/(m2•K). What temperature will exist 1.5 cm from the surface of the ingot after a cooling time of 583 sec (9.72 min)?" Consider the rod as acylinder placed vertically.
Physics
1 answer:
nevsk [136]3 years ago
7 0

Answer:

fgfgfdgdg

Explanation:

gfdgfgfgd

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3 years ago
C1=4F, C2=4F, C3=2F, C4=4F, C5= 9.2 F. Calculate the equivalent capacitance
grin007 [14]

The equivalent capacitance between A and B points is 2.5F.

<h3>What is parallel plate capacitor?</h3>

The two parallel plates placed at a distance apart used to store charge when electric supply is on.

The capacitance of a capacitor is given by

C = ε₀ A/d

From the given circuit C1, C2 and C3, C4 are in parallel  C1=4F, C2=4F, C3=2F, C4=4F, C5= 9.2 F

C1, C2 = 4 +4 =8F

C3, C4 = 2 +4 =6F

Now , all capacitors are in series.

Total equivalent capacitance is
1 / Ceq = 1/ 8 +1/6 +1/ 9.2

Ceq = 2.5 F

Thus,  the equivalent capacitance between A and B points is 2.5F.

Learn more about parallel plate capacitor.

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6 0
2 years ago
Please help me with this question someone
Gekata [30.6K]
From the answers provided, I believe the possible answer would be the last option, silicon, oxygen, and one or more metals. Here's my reasoning: the most abundant mineral group found in the Earth's crust is the silicate group. The silicate materials contain both oxygen and silicon. Silicates are the most common minerals in the rock-formation process, and it has, in fact, been estimated that they make up 75 to 90 percent of the Earth's crust. From this piece of evidence, I can guess that the answer will possibly be D, silicon, oxygen, and one or more metals.
It should also be noted that the additional elements that combine with the silicon-oxygen tetrahedron are involved with the other elements commonly found in the Earth's crust and mantle. They are aluminum, calcium, iron, magnesium, potassium and sodium.
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A material through which electronics do NOT easily flow is
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Resistor. The answer is a resistor. They do not transmit electricity. 
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