Answer:
Option A.
Lower air pressure results in a lower boiling point
Explanation:
This is because in an open system, the lower the pressure the lesser the energy that will be required for boiling point. The is little or no collision of air molecules with the surface of the liquid
But if there is increase in pressure, more energy will be required to get to boiling point because there will be strong collision between air molecules and surface of the liquid.
The melting point of pure lead : 327 °C
<h3>Further explanation</h3>
Given
Amount of tin and melting point of solder
Required
The melting point
Solution
The composition of solder = tin and lead
So if it is 100% tin, 0% lead or 0% tin, 100% lead
From the table it is shown that when the position is 100% tin in the solder, the melting point of the solder is 232 °C, so it shows that the melting point of pure lead is obtained when% tin in solder = 0 (100% lead in solder), so that the melting point is obtained. : 327 °C
