<span>The main building block of all silicate mineral is tetrahedron</span>
Answer:
R aluminium = 2.63x10^-6 Ω*cm
Rcopper = 1.7 x10^-6 Ω*cm
I would use Cu as interconnections in advanced CMOS nodes.
Explanation:
the conductivity formula equals:
σ = n*g*u
n = carrier concentration
u = mobility
g = charge of carrier
The resistivity is equal to:
R = 1/σ
For the aluminium, we have:
g = 1.602x10^-19 C
R = 1/(1.98x10^23 * 1.602x10^-19 * 12 = 2.63x10^-6 Ω*cm
For copper:
R = 1/(8.5x10^22 * 1.602x10^-19 * 43.2) = 1.7 x10^-6 Ω*cm
According to the calculations found for both resistivities, I would use Cu as interconnections in advanced CMOS nodes, since copper has a lower resistivity and therefore, copper conducts electricity better.
Answer:
Covalent network solids are formed by networks or chains of atoms or molecules held together by covalent bonds. Consists of sp3 hybridized carbon atoms, each bonded to four other carbon atoms in a tetrahedral array to create a giant network. Examples of network covalent solids include diamond and graphite (both allotropes of carbon), and the chemical compounds silicon carbide and boron-carbide.
Hope this helps and have a nice day!
