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3 years ago

5

Which type of design does not need special care for the placement of dimensions?

1 answer:

Pavlova-9 [17]3 years ago

5 0

Answer:

Software Engineering Design

Explanation:

Software design is the process of outlining solutions planning and specification of method of implementation based on the requirements of the user to reach the objective of a software by the use of the synthesis lower level, machine understandable, algorithms, given a set of parameters based on project requirements, or environmental constraints

Software engineering deals mainly with arranging lines coding, which are stored in the computer or device memory rather than in the physical space.

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9 Consider fully developed conditions in a circular tube with constant surface temperature Ts Tm. Determine whether a small- or

mojhsa [17]

Answer:

Hello your question is incomplete attached below is the complete question

answer:

Considering Laminar flow

Q ( heat ) will be independent of diameter

Considering Turbulent flow

The heat transfer will increase with decreasing "dia" for the turbulent

heat transfer = f(d^-0.8 )

Explanation:

attached below is the detailed solution

Considering Laminar flow

Q ( heat ) will be independent of diameter

Considering Turbulent flow

The heat transfer will increase with decreasing "dia" for the turbulent

heat transfer = f(d^-0.8 )

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3 years ago

The simply supported beam in the Figure has a rectangular cross-section 150 mm wide and 240 mm high.

8_murik_8 [283]

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3 years ago

Which of the following is an example of a hardwood? A maple B spruce C pine D fir

bearhunter [10]

Answer:

A. Maple

Explanation:

Maple is a hardwood.

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2 years ago

Which of these passages is an example of cohesive writing?

Oksana_A [137]

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3 years ago

Read 2 more answers

If copper (which has a melting point of 1085°C) homogeneously nucleates at 849°C, calculate the critical radius given values of

____ [38]

Answer:

The critical radius is -1.30 nm

Explanation:

Temperature for homogenous nucleation of copper, $T_{H} = 849^{0} C = 849 + 273 = 1122 K$

Melting point of copper, $T_{cu} = 1085^{0} C = 1085 + 273 = 1358 K$

Latent heat of fusion, $H_{f} = -1.77 * 10^{9} J/m^{3}$

Surface free energy, $\gamma = 0.200 J/m^{2}$

Critical radius, r = ?

The formula for the critical radius is given by:

$r = \frac{2 \gamma T_{cu} }{H_{f}(T_{cu} - T_{H}) }$

$r = \frac{2 * 0.2*1358 }{(-1.77 * 10^{9}) (1358 - 1122) }$

$r = \frac{543.2 }{(-1.77 * 10^{9}) 236}\\r = -1.30 * 10^{-9} m\\r = -1.30 nm$

The critical radius is -1.30 nm

8 0

4 years ago